Tiếng ViệtComprehensive Turnkey IC Testing Services
Tailored turnkey IC testing solutions covering test program development, multi-platform conversions, multi-package support, device characterization, and reliability testing for all customer needs
Tại Sao Chọn VNST?
Mang đến giải pháp toàn diện, đổi mới và chất lượng cao, thúc đẩy sự phát triển bền vững của ngành công nghiệp bán dẫn
Giá cạnh tranh
Giải pháp kiểm thử và thiết kế với chi phí tối ưu, đảm bảo giá trị cao nhất cho khách hàng.
Dịch vụ linh hoạt
Tùy chỉnh giải pháp để đáp ứng chính xác nhu cầu của từng khách hàng.
Công nghệ nổi bật
Kiểm thử tốc độ cao đến 10 Gbps, song song trên 128 pin, và điện áp cao đến 2000V.
Quick Turnaround Time
Thời gian thực hiện nhanh chóng, giúp rút ngắn chu kỳ phát triển sản phẩm.
Key IC Testing Processes
Functional Testing
Every IC must pass functional testing to ensure it operates according to its designed specifications. Testing methods include:
- JTAG Boundary Scan – Tests IC pin connectivity without requiring power.
- Built-in Self Test (BIST) – Allows the IC to self-diagnose internal faults without external equipment.
- Parallel Scan – Speeds up testing by running parallel diagnostics on multiple ICs.
Parametric Testing
Evaluates the electrical and physical characteristics of ICs to ensure performance and reliability:
- Signal Integrity – Analyzes signal quality to detect noise and degradation.
- Thermal Test – Assesses IC performance under high temperatures to ensure durability.
- Leakage Test – Measures leakage current to identify design or manufacturing defects.
- Power Integrity – Verifies the stability of power distribution within the IC.
- ESD Test (Electrostatic Discharge Test) – Evaluates the IC’s resistance to electrostatic discharge, preventing damage from electrical shocks.
Cutting-Edge Technology
Utilizing industry-leading testing methodologies to ensure superior quality and optimal performance for all semiconductor products
Scan Chains
A structured test method that sequences data through flip-flops, enabling efficient fault detection and validation of internal logic paths.
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Built-in Self-Test (BIST)
An embedded testing mechanism that allows ICs to self-diagnose functional and structural defects, reducing external test dependency and improving efficiency.
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Failure Analysis
A systematic approach to identifying defects in ICs, utilizing advanced techniques like SEM and thermal imaging for precise fault localization.
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Burn-in Test
A stress test that exposes ICs to high temperature and voltage to detect early-life failures, ensuring long-term reliability and stability.
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Boundary Scan Testing (JTAG)
A non-intrusive test method for digital ICs, detecting faults without pin access. Essential for BGAs, ensuring full coverage and efficient debugging.
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VNST has become a key strategic partner, ensuring the quality and reliability of our FPGA products before they reach customers in the US and Europe.
VNST has become a key strategic partner, ensuring the quality and reliability of our FPGA products before they reach customers in the US and Europe.