Load Board Design & Manufacturing

VNST delivers high-performance Load Board solutions, combining advanced engineering and cutting-edge technology to ensure accuracy, reliability, and efficiency in semiconductor testing.

Why Choose VNST?

VNST provides optimized Load Board design and manufacturing, integrating advanced technology and expert engineering for superior quality and performance

Using Probe Pin (Cantilever & Vertical) and multi-layer PCBs (up to 60 layers) for peak precision and performance

A highly skilled team with extensive expertise in Load Board design and manufacturing

Tailored Load Board designs to meet specific customer requirements and technical needs.

Ensuring superior signal integrity and exceptional reliability across all operating conditions

Giải pháp kiểm thử và thiết kế với chi phí tối ưu, đảm bảo giá trị cao nhất cho khách hàng.

Tùy chỉnh giải pháp để đáp ứng chính xác nhu cầu của từng khách hàng.

Kiểm thử tốc độ cao đến 10 Gbps, song song trên 128 pin, và điện áp cao đến 2000V.

Thời gian thực hiện nhanh chóng, giúp rút ngắn chu kỳ phát triển sản phẩm.

Load Board Design & Manufacturing Process

VNST follows a professional Load Board design and manufacturing process, ensuring precision, quality, and optimal performance for every product.

Understanding customer specifications, IC package details, and testing requirements to ensure a tailored Load Board solution.

Phân tích yêu cầu

Developing schematics, PCB layouts, and signal integrity simulations using advanced design tools to optimize performance.

Loadboard Design

Producing high-density, multi-layer PCBs with precise fabrication techniques, ensuring reliability and durability.

Loadboard Manufacturing

Conducting electrical testing, impedance verification, and final validation to guarantee compliance with industry standards.

Quality Inspection

Cutting-Edge Technology

Utilizing industry-leading testing methodologies to ensure superior quality and optimal performance for all semiconductor products
Scan Chains semiconductor

Scan Chains

A structured test method that sequences data through flip-flops, enabling efficient fault detection and validation of internal logic paths.

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Built-in Self-Test (BIST)

Built-in Self-Test (BIST)

An embedded testing mechanism that allows ICs to self-diagnose functional and structural defects, reducing external test dependency and improving efficiency.

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Burn-in Test

Burn-in Test

A stress test that exposes ICs to high temperature and voltage to detect early-life failures, ensuring long-term reliability and stability.

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Failure Analysis

Failure Analysis

A systematic approach to identifying defects in ICs, utilizing advanced techniques like SEM and thermal imaging for precise fault localization.

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Boundary Scan Testing (JTAG)

Boundary Scan Testing (JTAG)

A non-intrusive test method for digital ICs, detecting faults without pin access. Essential for BGAs, ensuring full coverage and efficient debugging.

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VNST has become a key strategic partner, ensuring the quality and reliability of our FPGA products before they reach customers in the US and Europe.

Jason Zhu / CEO, GOWIN Semiconductor

VNST has become a key strategic partner, ensuring the quality and reliability of our FPGA products before they reach customers in the US and Europe.

Jason Zhu / CEO, GOWIN Semiconductor

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